Our analysis report includes the in-depth interpretation of the collected data. Our analysis report includes the in-depth interpretation of the collected data.
Application Areas
Semiconductor, Display, LED, PV, Optical Coating, Bio- and Medical Device, Thermoelectrics (TE), and Others

Surface, Film, and Materials Analysis

All of our analysis data are backed by our 'Quality Assurance Program (QAP).'

  • 'Free Technical Consulting' on analysis strategy to understand your thin film materials and to find scientific solution

  • Surface Analysis
    1. X-ray photoelectron spectroscopy (XPS)
    2. Auger electron spectroscopy (AES)
    3. Atomic force microscopy (AFM) & SCM, EFM, and so on
    4. X-ray diffractometer (XRD)/X-ray reflectometer (XRR)
    5. Single crystal XRD
    6. Contact angle analyzer
    7. Spectroscopic reflectometer
    8. Stylus and optical surface profilers
    9. Surface roughness tester
    10. And more ...
  • Thin film analysis
    1. Transmission Electron Microscopy (TEM)
      • High-resolution (S)TEM and EDS
      • Cs-corrected STEM (5x better resolution than HR-TEM) and EELS
      • Cross-section sample preparation by FIB or polishing
    2. Cross-section imaging by Focused Ion Beam (FIB)
    3. X-ray diffractometer (XRD)/X-ray reflectometer (XRR)
    4. Secondary ion mass spectrometry (SIMS)
    5. Depth-profile XPS/AES
    6. Scanning electron microscopy (SEM)
    7. Raman spectroscopy
    8. FT-IR microscope
    9. Rutherford backscattering (RBS)
    10. Spectroscopic ellipsometer (SE)
    11. Magnetometer (20 - 500K)
    12. UV-Vis spectrophotometer
    13. 4 point probe resistivity measurement
    14. Porosimeter
    15. Stress measurement
    16. Nano-indenter
    17. And more ...
  • Bulk/Thermoelectric analysis
    1. Seebeck coefficient/electrical resistance (ZEM-3)
    2. Thermal conductivity
    3. Oxygen, Nitrogen, and Hydrogen analysis (ONH-2000)
    4. Inductively Coupled Plasma Mass Spectrometry (ICP-MS)
    5. Inductively Coupled Plasma Optical Emission Spectroscopy (ICP-OES)
    6. And more ...
  • Thin Film Materials & Process

    • 'Free Technical Consulting' on thin film technology to find new materials or best deposition or process methodologies in various applications such as LED EQE improvement, Oxide TFT for display, LowE window glass, hydrophobic coating for medical device, and others

    • Collaboration program to find new thin film materials with customized properties

    • Sputter Deposition
      1. 4-Chamber Co-sputter Deposition System for 8" and 12" Full Wafers
      2. 3-Chamber Co-sputter Coupon Deposition System
      3. Endura 5500 for various metal/metal nitride for both Cu & non-Cu
      4. Co-sputter Deposition system for isolated spots
      5. Materials: pure or alloy metals, oxides, nitrides, LiPON, and more on various substrates
    • Other deposition technologies
      1. Evaporation: 4-chamber evaporation system
      2. ALD for Al2O3 and HfO2
      3. LPCVD for (various Si, nitrides, & TEOS
      4. PECVD for oxides, nitrides, TEOS, BPSG, and MEMS
      5. CVD-W and HDP
      6. Electroplating
      7. III-V or II-VI Epitaxial Deposition by MOCVD
      8. Graphene by CVD
      9. And more ...
    • Bio- and medical applications
      1. Parylene coating
      2. Chip aligner for Lab on a Chip
      3. Plastic micro injection mold
      4. Plastic device system (CNC)
      5. Plotting cutting
      6. Sonic bonding
      7. Plastic micro injection mold
      8. LB trough
      9. Micrometrics BET
      10. Nano cluster & generator
      11. Small media mill
      12. High pressure/temperature multiple reactor
      13. And more ...
    • Glove box
    • Vacuum oven
    • Semiconductor IC Chip Analysis

      • 'Free Technical Consulting' on semiconductor IC chip analysis to understand device characteristics, processes, circuit architectures, and systems

      • Process Analysis
        1. Non-destructive analysis (before decapsulation); X-ray & backside Infrared imagings
        2. Chip decapsulation
        3. Layer-by-layer imaging and analysis by polishing or FIB
        4. Cross-sectional analysis using SEM & TEM
        5. Composition materials analysis using EELS & EDS mapping/scanning
      • Circuit Extraction and Analysis
        1. Layer imaging and architectural analysis
        2. Circuit schematic extraction & annotation
        3. Circuit verification through simulation
        4. And more ...
      • Electrical Characteristics Analysis
        1. Parameter extraction such as I-C, C-V, Leakage Current, and so on