Who are we?

Outermost Technology is a surface and thin film specialized service company located in the Silicon Valley region of California. Our highly experienced process/device engineering team is affiliated with R&D centers which have state-of-the-art metrology tools, deposition equipment, and device fabrication workflows. Through collaboration, Outermost Technology can provide services in material analysis and new thin film material at an affordable price with a fast turnaround time. Top quality services will be guaranteed through our 'Quality Assurance Program (QAP)'.

Quality Assurance Program (QAP)
  • All measurements and analyses are performed by Ph.D. level scientists.
  • All analysis reports are reviewed by Outermost Technology scientists before release.
  • Outermost Technology provides professional feedback for all customer questions regarding reports.
  • If customers are not satisfied with their measurement output, Outermost Technology will be happy to provide re-measurement for verification.
Free Technical Consulting
  • The technical team of Outermost Technology will provide free consulting on thin film technology (includes materials analysis and film deposition). You may call us at (408) 721-6800 or submit a description of your problem through our 'Contact' page. We will get back to you as soon as we can.
  • All consulting services are provided free of charge. You will recieve them via email or in a document..
  • There will be no obligation of recieving services through Outermost Technology for these consulting services.

Three business foci:






IC Chip Analysis


New Thin Film Materials


Materials Analysis


Material Analysis

State-of-the-art metrologies
  • Surface analysis: AES, XPS, AFM, and profilometer
  • Thin film analysis: d-profiling AES/XPS, high resolution TEM, SEM, EDS, ellipsometry, SIMS, XRD, etc.
  • Consulting is formulated with cost and time efficiencies in mind.

New Thin Film Materials

New materials for film stacks
  • Metal, metal oxide, metal nitride, or other multinary composition materials in the form of unit film or film stack with propietary expedited development approach
  • Consulting for the optimized workflow in terms of cost and time
  • Utilization of various state-of-the-art metrology equipments

IC Chip Analysis

New design development, IP protection, and failure analysis
  • IC chip characteristics, process and material analysis, and circuit extraction
  • Consulting for goal specific analysis workflow
  • Full service along with state-of-the-art metrology equipment