New Website Launch
October 7, 2019
Outermost Technology is pleased to announce the launch of our newly redesigned website, https://www.outermost-tech.com. Featuring a brand new look, the new website offers more information on our existing services (Materials Analysis and Reverse Engineering), and also introduces our new services: Failure Analysis and Reliability Testing. We hope you will find the website easier to navigate and more informative.
September 1, 2019
Outermost Technology introduces new services! Customers seeking ISO9001:2015 compliant Reliability Testing and Failure Analysis services can now leverage Outermost Technology team expertise to ensure that the most appropriate technique are tailored to customer’s specific needs. By providing 8D report with its Failure Analysis service Outermost Technology is at the leading edge of that industry!
August 12, 2019
Outermost Technology is growing! Laurent Kitzinger joins as Sr. Director of Marketing. Laurent brings with him 20 years of experience in the semiconductor industry. His most recent position before Outermost Technology was at Picarro where, as Sr. Director of Global Business Development Semiconductor, he led the penetration into top IC and memory manufacturers. He holds a MS in Electrical Engineering and an MBA from INSEAD. Laurent will oversee the company’s marketing strategy including services development, customer relationships and business development.
May 15, 2019
Outermost Technology becomes the provider of high volume TEM services for a leading worldwide LED manufacturer after being the only one out of three metrology service providers to pass the qualification tests.
March 28, 2019
Outermost Technology announces the closing of a seed series investment. The company will use the funding to further develop its service offering focused on semiconductor, LED and self-driving automotive industries.
November 1, 2017
Outermost Technology now offers Reverse Engineering Services! With these services the company will support its customers needing help with IC chip design, intellectual property dispute and patent evaluation.