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Reverse Engineering
Reverse Engineering Services
Structural Analysis
Functional Block Analysis
Package Analysis
Parallel Lapping
Dual Beam FIB/SEM
High Resolution Optical Microscope
Polishing/Ion Milling
SEM/EDS
TEM/EDS/EELS
APT
SCM
Wet/Dry Etching
X-ray Imaging
FIB
SEM
Block Identification
Chip/Pad Dimensions
IO Pads
Technology Node
Memory Block/Size
Memory Type
Metal Structure
Material Identification
Bump Pitch/Pad
Metal Layer/Via
Package Layer
Pin Connection Configuration
Pin Mapping
Polyimide
Solder Ball/Pad
UBM Size
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