Technology

• 2D X-ray Inspection
• 3D X-ray CT Scanning
• Atomic Force Microscopy (AFM)
• Brinell, Vickers, and Rockwell Hardness
• Brunauer-Emmett-Teller (BET)
• Circuit Extraction
• Confocal Scanning Acoustic Microscopy (C-SAM)
• Differential Scanning Calorimetry (DSC)
• Dynamic Light Scattering (DLS)
• Dynamic Mechanical Analysis (DMA)
• Fourier Transform Infrared (FTIR) Spectroscopy
• Gas Chromatography Mass Spectrometry (GC-MS)
• Gel Permeation Chromatography (GPC)
• High Performance Liquid Chromatography (HPLC)
• IC Device Decapsulation
• IC Device Repackaging
• Induced Coupled Plasma – Mass Spectrometry (ICP-MS) & Optical Emission Spectroscopy (ICP-OES)
• Ion Chromatography (IC)
• Liquid Chromatography-Mass Spectrometry (LCMS)
• Matrix Assisted Laser Desorption/Ionization (MALDI)
• Metallurgical Microscopy
• Nano-Indentation
• Nuclear Magnetic Resonance (NMR)
• Package Analysis
• Process and Functional Block Analysis
• Raman Spectroscopy (Raman)
• Rutherford Backscattering (RBS)
• Scanning Electron Microscopy (SEM)
• Secondary Ion Mass Spectrometry (SIMS)
• Tensile and Bending Tests
• Thermogravimetric Analysis (TGA)
• Transmission Electron Microscopy (TEM)
• UV-Vis-IR Spectroscopy
• X-ray Diffraction (XRD)
• X-ray Fluorescence (XRF)
• X-ray Photoelectron Spectroscopy (XPS)
• X-ray Reflectometry (XRR)