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Burn-In

Equipment: Micro Control Company HPB-4

Working Principle

  • Understand wide variation in heat dissipation
  • Define diverse burn-in needs of VLSI devices
  • Detest early failures

Technical Information

  • Static Burn-in: apply extreme voltages and temperatures to each device
  • Dynamic Burn-in, apply extreme temperature and voltages and input stimuli to each device
  • Stress the device and dormant faults will be accelerated
  • Standard: MIL-STD-833C, Method 1015.3

Degradations in Burn-In Test

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