Memory Twist Test System
Equipment: Instron MS555
Working Principle
- The system generates and
measures the
twist applied on
package
- Align the package / device and ensure
surface is parallel to
the reference plate
- Correct warpage
- Standard: JEITA- ED-7306
Technical Information
- Avoid warpage on package, wafer, or packaged device
- Avoid poor connections
- Understand which portion of the sample is twisted and damaged as a function of torque
Solder Ball Connection Problems