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Memory Twist Test System

Equipment: Instron MS555

Working Principle

  • The system generates and measures the twist applied on package
  • Align the package / device and ensure surface is parallel to the reference plate
  • Correct warpage
  • Standard: JEITA- ED-7306

Technical Information

  • Avoid warpage on package, wafer, or packaged device
  • Avoid poor connections
  • Understand which portion of the sample is twisted and damaged as a function of torque

Solder Ball Connection Problems

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Last Updated: February 17, 2020
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