Reactive Ion Etching (RIE)
Equipment: RIE System
Working Principle
- High-energy ions from the plasma attack the sample surface and react with it
- Plasma is initiated in the system by applying a strong RF electromagnetic field
to the sample platter
- Chemically reactive plasma removes material deposited on samples
Technical Information
- Etch a wide variety of materials, including dielectrics, polymers, and metals
- De-process IC unit, remove moulding compounds to access internal circuit structure
- Reverse engineering work
Etched IC
Contact
