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Reactive Ion Etching (RIE)

Equipment: RIE System

Working Principle

  • High-energy ions from the plasma attack the sample surface and react with it
  • Plasma is initiated in the system by applying a strong RF electromagnetic field to the sample platter
  • Chemically reactive plasma removes material deposited on samples

Technical Information

  • Etch a wide variety of materials, including dielectrics, polymers, and metals
  • De-process IC unit, remove moulding compounds to access internal circuit structure
  • Reverse engineering work

Etched IC

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