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Temperature Cycle

Equipment: Temperature

Working Principle

  • The components and solder interconnects are supposed to withstand extreme high and low temperature environment
  • Temperature changes in cycling style from high to low
  • Failures may be induced during the test (-65 – 300 °C)
  • Standard: Mil-Std-883 Method 1010

Technical Information

  • Test solderability
  • Determine the ability of the package to withstand rapid changes of temperature
  • Accelerate the effects of thermal mismatch amongst the die/assembly components

Temperature Cycling Profile

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