IC Chip Materials Analysis & Device Testing

Board Level Reliaiblity Testing (BLRT)

Evaluation of quality and reliability of solder joints between IC and PCB to ensure reliable interconnect performance under extreme conditions.
Very critical especially for portable or automobile applications.

Atomic Force Microscope (AFM)

Conductive AFM (c-AFM)

Scanning Capacitance Microscope (SCM)

Scanning Spread Resistance Microscope (SSRM)

c-AFM, SCM, and SSRM are all based on the AFM technology. With c-AFM, contact quality of metal electrodes to GaN can be analyzed through I-V curve. SCM shows active carrier distribution with operation bias applied. And SSRM shows the quantitative resistivity value and the right SSRM image was scanned for the doping profile of 16nm 2D NAND flash chip.

Cs-Corrected Transmission Electron Microscopy (Cs-TEM)

Energy Dispersive Spectroscopy (EDS)

Electron Energy Loss Spectroscopy (EELS)

As the semiconductor industry advances through the extremely small (down to 3 nm) technology nodes, the needs for the super-high -resolution TEM becomes increases. Outermost’s service includes TEM imaging using aberration corrected TEM (Cs-TEM), whose resolution is at least 5 times better than the typical high-resolution TEM, at very affordable pricing. Accurate measurement of nano-scale film thickness is critical in the development of modern IC devices. Using our proprietary in-house TEM image analysis software, we provides most accurate measurement of the nano-scale film thickness and its uniformity.