How to use the Bee portal?
Click “Quote Request” in the nagivation bar, and complete the Sample Submission Form that corresponds to your requirements.
A member of our technical team will contact you with a quotation.
Initiate your job submitting your Purchase Order directly through the portal.
Schedule a pick-up or ship your samples directly to our Headquarters.
Key Updates
Jan. 2024CTE measurement of dielectric amorphous films
Dec. 2023ICP-OES to quantify unknown component elements
Nov. 2023Polymer characterization with multiple techniques: FTIR, GPC, Raman, TGA, and DSC
Oct. 2023Ion Chromatography analysis of solvent samples for fluorine in ppb level
Sep. 2023MALDI-ToF analysis of polymer samples
Aug. 2023ICP-MS and IC anion analysis for new electrolyte development
Jul. 2023Unknown particle defect analysis on wafer using TEM-EDS
Jun. 2023Purity analysis of organic material batch using ICP-MS and IC
May 2023Cs-TEM-EDS of a bulk copper piece coated with unknown graphene.
Apr. 2023SEM-EDS on a glass piece to identify defects.
Mar. 2023X-sectional polishing of LED device for FA at interfaces
Feb. 2023Nano-scale analysis of onion shape graphene with Cs-TEM
Jan. 2023EBSD analysis of tungsten film
Dec. 2022Structure/composition analysis of HEMT by TEM/EDS
Nov. 2022Two-side Polishing of Micro LED Device
Oct. 2022Unknown coating material analysis of parts used in plasma process chamber
Sep. 2022Layer structure analysis of graphene using Cs-TEM
Aug. 2022Failure analysis of metallized ceramic using 3D CT, CSAM, and SEM-EDX
Jul. 2022Karl Fisher/FTIR/GC-FID analysis of an organic solvent
Jun. 2022C-, F-, and H- NMR analysis of organic solutions for graphene
May 2022XPS analysis for an identification of organic contaminations
Apr. 2022TEM/EDS analysis on HEMT device
Mar. 2022Hi-resolution d-XPS analysis for ITO for uLED application
Feb. 2022C-SAM for advanced wafer bonding technology
Jan. 2022Device structure analysis using FIB-TEM-EDS analysis of a whole wafer
Dec. 2021Electrical and structural analysis of high capacitance materials in MIM structure
Nov. 2021Cross-sectional failure analysis of micro-LED display parts
Oct. 2021Analysis of biological molecules using Nanoscale FTIR
Sep. 2021Quantification and identification of fungicidal toxins in fruit
Aug. 2021Electrochromic device dopant identification and profile using ion milling and SSRM
Jul. 2021Contaminant analysis of electrolyte solutions using ICP-MS and GC-MS
May 2021Polymeric structural characterization using Nuclear Magnetic Resonance (NMR)
Apr. 2021SEM analysis of battery composites
Mar. 2021Fluorescence measurement of plastic films for research
Feb. 2021DSC measurement of metal alloys for development
Feb. 2021Metal composition testing by ICP for alloy development
Jan. 2021Flash point measurements for solvents for development
Jan. 2021Ion chromatography of semiconductor samples for failure anlaysis
Dec. 2020Optical measurements on silver coated mirrors for research
Dec. 2020LA-ICP-MS for trace metal analysis of semiconductor films for development
Nov. 2020TGA measurements of polymer samples for development
Nov. 2020TEM and EDS of LED Device Structures for failure analysis
Oct. 2020XRR for density and thickness of dielectric films for semicondcutor development
Oct. 2020XPS Depth profiles of metal oxide films for semiconductor research
Sep. 2020NMR of polymer samples to measure ligand ratios for polymer development
Sep. 2020Kelvin probe measurements of LED device structure for research
Aug. 2020Heated ellipsometry measurements for medical devices for research
Aug. 2020RBS measurements of ferroelectric thin films for memory development
Jul. 2020Cross section SEM measurements on coated metals for semiconductor development
Jul. 2020ToF depth profiles on LED device structures for semiconductor failure analysis
Jun. 2020Extensive analysis of carbon powerder using TEM/EDS/TGA/XPS/FTIR/SEM for new graphene development
Jun. 2020TEM+EDS analysis of GaN device structures for power device development
May 2020Optical profilometry for defect characterization on transparent plastics for nuclear industry
May 2020Reverse engineering of glue sample using DSC and FTIR for pest control failure anlaysis
Apr. 2020GC-MS testing for toxicoloy of avocados for food development
Apr. 2020Nano-FTIR of dielectric films for studying surface bonding for new semiconductor materials
Mar. 2020M-SIMS depth profiles of doped material for optical telecommunication application
Mar. 2020EELS Measurements on Dielectric films for semiconductor research
Feb. 2020TEM/SEM/XRD/Uv-Vis analysis of Ag nanowires for transparent displays application
Feb. 2020Measuring surface area of carbon powders using nitrogen gas for graphene industry
Jan. 2020Polymer identification using TGA hyphenated to a GC-MS for semiconductor failure analysis
Jan. 2020High Resolution ToF-SIMS depth profiles of Magnetic RAM (MRAM) development
Jan. 2024TSV analysis of DDR4 memory device
Dec. 2023Failure analysis of slighted opened coil
Nov. 2023CIS image sensor (Samsung and Sony) design analysis for IP litigation
Sep. 2023Structure analysis of HBM2 memory device packaging
Aug. 2023Die imaging of IC device for AI application
Jul. 2023X-sectional analysis of DDR5 focused on airgap and liner layers
Jun. 2023Multi-stack CIS image sensors from major brand smartphones
May 2023TSV structure analysis of DDR5 DRAM device
Mar. 2023Full process analysis report release of a SoC device of a major brand smartphone
Nov. 2022Top down high-resolution imaging of fin and gate from 14nm FinFET based device
Sep. 2022Package and process analysis of SoC used in major brand smartphone
Jul. 20223D CT failure analysis of new circuit board stack structure
Jun. 2022Decapsulation of metal packaged server CPU
May 2022Contract on the development of a new application of SCM for nano-LED application
Apr. 2022Die marking imaging for a full SSD products of a major manufacturer
Feb. 2022Image sensor dopant profile analysis in a smartphone camera of a key manufacturer
Jan. 2022Charge trap cell structure analysis of NOR and NAND devices from a major manufacturer
Dec. 2021Identification of top oxide layer on active fin from an advanced DRAM product
Nov. 2021Extensive reliability testing of a wearable device for health monitoring
Sep. 2021Comprehensive 5nm FinFET process analysis from Apple A14 AP chip from the 1st biggest foundry and functional block analysis is also done
Aug. 2021SCM & SSRM scanning, Hall measurement to check Ohmic contact to p-GaN in a nanowire LED device
Jun. 2021Comprehensive process analysis report for mobile SoC chip having 14nm FinFET process from the 2nd biggest foundry
Apr. 2021OLED pixel analysis with dopant identification and profiles using Cs-TEM, u-spot d-XPS, and SCM
Mar. 2021Complete functional block analysis of SSD SoC chips including SRAM size estimation for key
Feb. 2021Thorough analysis of nanorod structure for u-LED application using Cs-TEM/EDS/EELS
Dec. 2020High speed SSD (1700MB/s) SoC analysis with its SRAM and metal process
Jun. 2020Merged contact structure comparison of Sony PS4 Pro, Xbox One X, and Nintendo Switch
Apr. 20203D NAND memory structure analysis with planeview and cross-section with Cs-TEM/EDS
Feb. 2020Layer structure and material analysis of Micron DRAM with 20 nm technology
Sep. 2019Toshiba image sensor analysis
Dec. 2019Functional block analysis of Intel SSD SoC for 8TB product
Oct. 2019Dopant profile and type analysis of Toshiba’s 15 nm technology-based NAND memory by SCM and SSRM
Sep. 2019Charge trap memory cell analysis of 3D NAND Flash memory
Aug. 201965 nm node image sensor analysis used for SONY A9 digital camera