Intellectual Property (IP) related engineering analysis determines if there is unauthorized use of others’ IP in a product or process. Outermost Technology provides full-scale IP-related services from patent portfolio review/mining to infringement verification and finally creating patent claim charts. Outermost Technology has extensive reverse engineering (RE) experience using most advanced equipment like aberration-corrected or multi-EELS signal detectors TEM, SCM, SSRM, at fast analysis turn-around-time (TAT), typically less than two weeks, and expertise in the patent claim infringement verification, and drafting the patent claim chart. Outermost Technology can provide a sample patent claim chart targeting the chips developed by the top-tier chip company and manufactured by the top-tier foundry company upon request.
| Type of Work | Description |
|---|---|
| Patent Portfolio Review & Mining |
1. Review each patent from a group of several hundreds 2. Pick out patents closely related to the target products or companies 3. Make the list based on the patents of interest 4. Research target products from the company of interest in terms of the potential patent |
| Verification of Patent Claim Infringement |
1. Establish engineering analysis plan for target products 2. Purchase target products 3. Process the engineering analysis 4. Provide analysis summary report |
| Patent Claim Chart |
1. Draft the patent claim chart based on the engineering analysis results 2. Please see the sample patent claim chart |
| FUNCTIONAL BLOCK ANALYSIS | |
|---|---|
| 5 IO Pad Identified from the Active Layer | Memory Structure |
| STRUCTURE ANALYSIS | |
|---|---|
| SRAM Cell Analysis | Device Dimensions |
| ADVANCED TECHNOLOGIES |
|---|
| TEM/EELS |
| SCM for Dopant Type |
| SSRM for Dopant Profile |
| Reverse Engineering from System to Silicon | |
|---|---|
| Package Analysis | Bump pitch/pad, metal layer/via, substrate information, pin connection configurations, pin mapping, polyimide, UBM size, and more |
| Functional Block Analysis | Block identification, IO pads, memory block/size, memory type, material identification, technology node, and more |
| Die Structure Analysis | Feature size, metal layer, area, process, design type, pad number, and more |
| Advanced Technologies | Ultra-high resolution TEM/EDS/EELS, SCM (dopant type), SSRM (doping profile), and more |
| Circuit Extraction | Device architecture overview, signal integrity, check specific circuit, and locate the component, and more |
Sample Claim Chart
 Download Sample Version
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