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Materials Analysis
Atomic imaging, elemental analysis, lattice spacing, depth profiling, void identification, void distribution along film depth, and crystalline structure

Reliability Testing
Parameters Tested
Total Luminous flux, Rx/Tx
Light distribution
Lumen degradation
6000 hours testing covers packages, arrays and module

Test Standards
LM79 & LM80
Failure Analysis
Typical Failure Mode
EOS (environment too hot)
Open circuit (plugged on wrong supply)
Emitter degraded and color changed (function failure)

Reverse Engineering
Non-destructive and destructive, depackaging, cross-section, material identification like phosphor, and package analysis

As LED devices include complicated nanoscale thin film structures, TEM/EDS/EELS are critical techniques for quality control and failure analysis. Outermost Technology has established a set of services for LED device characterization and has been recently selected as a high-volume service provider by a world leading LED manufacturer.

PALS/DBS are non-destructive spectroscopic techniques to study voids and defects in single crystalline materials. These techniques can identify the type and distribution of defects along the film’s depth. It is an ideal metrology for the LED industry.

PCA is an orthogonal transformation to convert a set of observations of possibly correlated variables into principal components. The PCA-ToF SIMS can be widely used for materials identification or for mapping (polymers, organics, or bio-materials}.

OBIRCH is a very powerful fault localization technique for IC’s. In Failure Analysis OBIRCH is commonly used to localize metal shorts, active area short, shorts in source, and drain wells.
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