High Temperature Storage Test (HTST)

Equipment: Thermal Chamber-MSK-1050PR

Working Principle

  • Devices are subject to continuous storage in a chamber with circulating hot air (up to 150 °C)
  • No electrical stress applied
  • The test may be destructive, depending on time, temperature and packaging
  • 1000 hours, 150 °C
  • Standard: JESD22-A103C

Technical Information

  • Determine the effect of temperature and time
  • To evaluate the thermally activated failure mechanisms within the devices
  • Applicable to non-volatile memory devices (data retension failure mechanisms)

Frequency Changes vs. Temperature