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Parallel Lapping

Equipment: ParaFlat ULM 8

Working Principle

  • Place a sample on a polishing pad
  • Place sample and polishing pad onto a lapping disc
  • Run the disc, add force and water at same time

Technical Information

  • View any layer of IC for further analysis
  • Perform reverse engineering work

An IC Device After Lapping

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Last Updated: February 17, 2020
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