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Pre-Conditioning Test

Equipment: Thermal Chamber

Working Principle

  • Perform on real samples as a 'preparatory' before major reliability testing
  • Baking drives away all the internal moisture within the samples
  • Temperature/humidity soak drives away the moisture in packaging
  • Thermal shock, which simulates the board soldering process itself
  • Standard: AEC Q100, AEC Q101, or JESD 22-A113

Technical Information

  • Check moisture soak requirements
  • Determine the ability of a device to withstand the thermal stresses
  • Determine the ability of a device to withstand the electrical stress

Residual Reducing vs. Iteration

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