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Solderability (SD)/Resistance to Solder Heat (RSH)

Equipment: SD/RSH Test System

Working Principle

  • The solder and resistance are usually sensitive to temperature changes
  • Conduct the heat through the leads into the device and package
  • Examine and confirm forward and backward assembly compatibility
  • More reliability testing for Pb-free materials
  • 217°C to 227°C
  • Standard: JESD22-A108D

Technical Information

  • Determine whether the devices terminations can withstand the effects of heat at the level they will be subjected
  • Determine if the solders are correctly selected for products specified on their data sheets
  • Characterize the resistance changes with temperature

Solderability Testing

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Last Updated: February 17, 2020
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