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We are a service provider and a problem solver in the following:

Material Analysis

Reliability

Design reliability plan for customers
Perform electrical, thermal, mechanical, environmental, accelerate life-time estimation, and from silicon level up to system level
Develop desk reliability theories include FMEA, DFx, SCM, QMS, Weibull analysis, reliability growth modeling as well as ISO9001:2018 and ISO26262
Apply standards JEDEC, MidStd, Tecordia, AEC, IPC, etc., based on customer’s requirements and products

Failure Analysis

There are three different tiers of Failure Analysis that we offer
- Tier 1 analysis is for initial testing methods such as electrical testing, non-destructive analysis, i.e. 2D/3D X-Ray imaging & C-SAM, and decapsulation of packages.
- Tier 2 analysis is for optical fault localization using a different methodology like PHEMOS/THERMOS, BIRCH, Backside IR imaging, and LCD analysis.
- Tier 3 analysis is to find the root of failure, using TEM & SEM testing methods along with EDS/EELS composition analysis and more advanced failure spot analysis like AFM, C/SCM/SSRM, and micro-probing, etc.
- Depending on your analysis objectives, we have the resources to perform other methods of failure analysis that range from decapsulation of the chips, cross-sectional sample preparation using FIB, Ion-milling for TEM/SEM, or AFM-based analysis.

Reverse Engineering

Structural Analysis-APT, decapsulation, FIB, high resolution optical microscope, parallel lapping polishing/ion milling, SCM, SEM/EDS, TEM/EDS/EELS, wet/dry etching, X-ray imaging
Functional Block Analysis-Block Identification, chip/pad dimensions, I/O pads, material identification, memory block/size, memory type, metal structure, and technology node
Package Analysis-Bump pitch/pad, metal layer/via, package layer, pin connection configuration, pin mapping, polyimide, solder ball/pad, and UBM size

IP Litigation

Outermost Technology specializes in supporting patent monetization firms with their litigation; we want to ensure that every bit of information is easily understood and transparent during the process, from start to finish, to ensure that we analyze your litigation needs.
- We provide key services such as reverse engineering, analysis of the results, and drafting patent claim charts.
- We also provide Patent Portfolio Review and help you determine which patients are most valuable and how each questioned patent is utilized in various products in the marketplace.
- Our Reverse Engineering Analysis reports can help verify the specifics details of how a specific piece of technology is infringing on copyrighted assets.
Here are the specific Reverse Engineering capabilities that we have access to:
- Structural analysis – APT, decapsulation, FIB, high-resolution optical microscope, and parallel-lapping.
- Functional block analysis-Block ID, chip/pad dimensions, I/O pads, material identification, memory type, metal structure, and technology mode.
- Package Analysis: pump pitch/pad, metal/via, package layer, pin connection configuration, pin mapping, polyimide, solder ball/pad, and UBM size.

* Our services are not limited to those listed above. Please contact us for additional details.

	Streamline R&D Services Technology selection, management, payment with one single account
	Affordable Price Access leading edge technologies at an affordable price
	Solution Provider Utilizing scientific expertise both in-house and in-network to solve your challenges
	Complimentary Consultation Before placing job order
	Fast Turnaround Time, Data Report Within 4 Days of sample Receipt Samples can be pre-diced or diced onsite furthur saving your time
	Professional Data Interpretation As a second opinion to yours
	Quality Assurance Program Free remeasurement if not satisfied